Diamond Systems Venus, 3.5" SBC

Venus, 3.5" SBC

Product Manufacturer - Diamond Systems 

 

Based on the "Skylake" or “Kaby Lake” 6th and 7th generation processors, Venus offers the highest available CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.

 

Product Features

 

▶︎ Intel "Skylake" 6th Gen Core i7-6600U 2.6GHz, or i5-6300U 2.4GHz

 

▶︎ Intel “Kaby Lake” 7th Gen Core i7-7660U 2.8GHz

 

▶︎ 4GB DDR4 RAM soldered on board

 

▶︎ Expansion socket for up to 16GB additional / 20GB total RAM

 

▶︎ 2x Gigabit Ethernet

 

▶︎ 2x SATA 3.0 ports + mSATA socket

 

▶︎ VGA, HDMI & dual channel LVDS with 3 simultaneous independent display support

 

▶︎ 4x RS-232/422/485 ports

 

▶︎ 6x USB 2.0 ports

 

▶︎ 4x USB 3.0 ports

 

▶︎ HD audio

 

▶︎ 16 GPIO lines with 3.3/ 5V logic levels

 

▶︎ TPM module

 

▶︎ CSI camera serial interface

 

▶︎ 2x PCIe MiniCard sockets; one socket supports mSATA

 

▶︎ OneBank-Plus PCIe/104 + PCI-104 expansion socket

 

▶︎ 9-18VDC input volta

 

▶︎ 14W power consumption typical

 

▶︎ 3.5 inch form factor: 5.75" x 4.0" (146mm x 102mm)

 

▶︎ -40°C to +85°C operating temperature

 

▶︎ Bottom-mounted heat spreader cooling

Product Specifications
  • Part number
  • Venus, 3.5" SBC
  • Processor
  • "Skylake U" i7-6600U 2.6GHz, or i5-6300U 2.4GHz, 2 cores 4 threads
    “Kaby Lake” 7th Gen Core i7-7660U 2.8GHz, 2 cores 4 threads
  • Chipset
  • Integrated onto processor package
  • Memory
  • Up to 20GB: 4GB memory down + socket for 4/8/16GB DDR4-2133 SODIMM / RSODIMM
  • Graphics
  • 3 independent displays: HDMI, VGA, and LVDS, max resolution 4096 x 2304
  • Ethernet
  • 2 Gigabit ports: 1 from chipset with i219 PHY, 1 from i210 on PCIe x1 lane, on-board LEDs for status
  • USB
  • 4x USB 3.0/2.0 ports on Intel standard USB 2.0 connectors + 2x USB 2.0 on separate connector
    2x USB 2.0 via PCIe/104 OneBank expansion connector
    2x USB 2.0 via PCIe MiniCard sockets
  • Serial
  • 4x multiprotocol RS-232/422/485, all features programmable including termination
  • Audio
  • HDA audio with Line in, Line out, and Mic in, ALC892 CODEC
  • Digital I/O
  • 16 lines with bitwise programmable direction, configurable 3.3V/5V logic levels, and configurable pull up/down resistors
  • Mass storage
  • 3 SATA interfaces: SATA DOM, Standard SATA, mSATA support in one MiniCard socket
  • Security
  • TPM module Infineon SLB 9670XQ2.0
  • Expansion
  • MiniCard sockets:
    1 socket supports full size MiniCard / mSATA modules
    1 socket supports full / half size MiniCard
    OneBank Plus (PCIe/104 + PCI-104) socket with 22mm stacking height
    Stackable I/O:
    2 Full size (51mm length)
    Supports up to 3 PCIe x1 Type 1 / Type 2 / OneBank I/O modules + up to 2 USB interface modules
    Supports up to 4 PCI-104 expansion modules
  • Connectors
  • Latching, JST GH / GHD series
  • Form factor
  • "3.5 inch" form factor: 5.75" x 4.0" / 146 x 102mm
  • Weight
  • 281.4 gms/ 9.92 ounces
  • Cooling
  • Conduction cooling heat spreader on bottom
  • Input voltage
  • 9-18VDC
  • Power consumption
  • 14W under typical operating conditions
  • Operating Temperature
  • -40° to +85°C

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