ADLINK cExpress-SL, Computer on Module (CoM)
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cExpress-SL, Computer on Module (CoM)

Product Manufacturer - ADLINK


The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.


The cExpress-SL Intel® processors support Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 32 GB of non-ECC DDR4 dual-channel memory at 1866/2133 MHz in dual stacked SODIMM sockets to provide excellent overall performance.


Integrated Intel® Generation 9 Low Power Graphics includes features such as OpenGL 4.4/4.3, DirectX 11.3/11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA2) support for AVC/VC1/MPEG2/HEVC/VP8/JPEG hardware decode and AVC/MPEG2/HEVC/VP8/JPEG hardware encode. Graphics outputs include dual-channel 18/24-bit LVDS (eDP by build option) and two DDI ports supporting HDMI/DVI/DisplayPort.


The cExpress-SL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The cExpress-SL features a single onboard Gigabit Ethernet port, up to six PCIe Gen3/2 ports (build option), four USB 3.0 ports, four USB 2.0 ports, and up to three SATA 6Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.


Product Features


▶︎ 6th Generation Intel® Core™ i7/i5/i3 and Celeron®

  3955U Processors (codename: Skylake)


▶︎ Up to 32GB non-ECC Dual channel DDR4 at

  2133/1867 MHz


▶︎ Two DDI channels, one LVDS (or 4 lanes eDP),

  support up to 3 independent displays


▶︎ Up to 6 PCIe x1 (by build option, up to Gen3

  dependent on SKU)


▶︎ GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 and

  4x USB 2.0


▶︎ Supports Smart Embedded Management Agent

  (SEMA) functions


▶︎ Extreme Rugged operating temperature:

  -40°C to +85°C (build option)


▶︎ cTDP support on specific skus

Product Specifications
  • Part number
  • cExpress-SL, Computer on Module (CoM)
Core System
  • Memory
  • Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket
  • Embedded BIOS
  • AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11.0 support
    (AMT support available on Core™ i7/i5 only)
  • Cache
  • 4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron®
  • Expansion Busses
  • Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option)
  • SEMA Board Controller
  • Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control,
    general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan
  • Debug Headers
  • 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
    60-pin XDP header for ICE debug of CPU/chipset
  • GPU Feature Support
  • Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs
    Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support
    OpenCL 2.1, 2.0/1.2 support
  • Digital Display Interface
  • DDI1/2 supporting DisplayPort/HDMI/DVI
  • LVDS
  • Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
  • eDP
  • 4 lane support build option, in place of LVDS
  • Chipset
  • Intel® HD Audio integrated in SOC
  • Audio Codec
  • On carrier Express-BASE6 (ALC886 standard support)
  • Intel® MAC/PHY
  • i219LM/V with AMT 11.0 support
  • Interface
  • 10/100/1000 GbE connection
I/O Interfaces
  • USB
  • 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
  • SATA
  • Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron® supports two ports
  • Serial
  • 2 UART ports with console redirection
  • GPIO
  • 4 GPO and 4 GPI from BMC
Super I/O
  • Super I/O
  • Supported on carrier if needed (standard support for W83627DHG-P)
  • Chipset
  • Atmel AT97SC3204
  • Type
  • TPM 1.2
  • Standard Input
  • ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
  • Wide Input
  • ATX = 5-20V / 5Vsb ±5% or AT = 5-20V
  • Management
  • ACPI 5.0 compliant, Smart Battery support
  • Power States
  • C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
  • ECO mode
  • support deep S5 mode for power saving
Operating Systems
  • Standard Support
  • Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit
  • Extended Support (BSP)
  • WES7 32/64-bit, Linux 64-bit
Mechanical and Environmental
  • Form Factor
  • PICMG COM.0: Rev 2.1 Type 6
  • Dimension
  • Compact size: 95 mm x 95 mm
  • Operating Temperature
  • Standard: 0°C to 60°C
    Extreme Rugged™: -40°C to +85°C (build option)
  • Humidity
  • 5-90% RH operating, non-condensing
    5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
  • IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
    Table 214-I, Condition D
  • HALT
  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

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