ADLINK Express-CFR, Computer on Module (CoM)
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Express-CFR, Computer on Module (CoM)

Product Manufacturer - ADLINK

 

The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.

 

The Express-CFR has up to three SODIMM sockets supporting up to 96GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon® processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

 

Product Features

 

  • PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors

 

  • Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation)

 

  • Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option)

 

  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)

 

  • Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)

Product Specifications
  • Part number
  • Express-CFR
Core System
  • CPU
  • Mobile 9th Generation Intel® Xeon®, CoreTM, Pentium® and Celeron® Processors - 14nm process
    • Xeon® E-2276ME 45W (35W cTDP), 6C/GT2 (ECC/non-ECC)
    • Xeon® E-2276ML 25W, 6C/GT2 (ECC/non-ECC)
    • Xeon® E-2254ME 45W (35W cTDP), 4C/GT2 (ECC/non-ECC)
    • Xeon® E-2254ML 25W, 4C/GT2 (ECC/non-ECC)
    • CoreTM i7-9850HE 45W (35W cTDP), 6C/GT2
    • CoreTM i7-9850HL 25W, 6C/GT2
    • CoreTM i3-9100HL 25W, 4C/GT2 (ECC/non-ECC)
    • Pentium® G5600E 35W, 2C/GT1 (ECC/non-ECC)
    • Celeron® G4930E 35W, 2C/GT1 (ECC/non-ECC)
    • Celeron® G4932E 25W, 2C/GT1 (ECC/non-ECC)
    Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.
  • Memory
  • Up to 96GB* 2133/2400 MHz DDR4 in three SODIMM sockets (*under validation, max. 48GB verified)
    (Xeon®, CoreTM i3, Pentium®, Celeron® paired with CM246 supports both ECC and non-ECC memory)
    (three sockets by build option)
  • Embedded BIOS
  • AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel® AMT 12.0 support
  • Cache
  • 12MB for Xeon® 6C, 8MB for Xeon® 4C, 9MB for CoreTM i7, 6MB for CoreTM i3, 4MB for Pentium®, 2MB for Celeron®
  • Chipset
  • • CM246 (supports ECC memory and Intel® AMT)
    • QM370 (supports Intel® AMT )
    • HM370 (no support for Intel® AMT )
    Note: Chipset is same as Coffee Lake.
  • Expansion Busses
  • • PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
    • 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
    • 2 PCI Express x1 (Gen3); CD connector, Lane 6/7
    • LPC bus, SMBus (system), I2C (user)
  • SEMA Board Controller
  • Supports: voltage/current monitoring, power sequence debug support,
    AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control
  • Debug Headers
  • • 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
    • 60-pin XDP header for ICE debug of CPU/chipset (optional)
Video
  • GPU Feature Support
  • Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs
    • Hardware encode/transcode HD content (including HEVC 10-bit)
    • DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1,
    DirectX 10,DirectX 9 support
    • OpenGL 4.5 support
    • OpenCL 2.1, 2.0/1.2 support
  • Digital Display Interface
  • DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI
    Notes:
    DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp
  • VGA
  • VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz)
  • LVDS
  • Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)
  • eDP
  • 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)
Audio
  • Audio
  • Chipset: Intel® HD Audio integrated in chipset
    Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported)
Ethernet
  • Ethernet
  • Intel® I219LM/V with AMT 12.0 support (only LM version support AMT) Interface: 10/100/1000 GbE connection
Multi I/O and Storage
  • Multi I/O and Storage
  • USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7)
    SATA: Four ports SATA 6Gb/s (SATA0,1,2,3)
    Serial: 2 UART ports with console redirection
    GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt)
    SD/GPIO muxed design, switched by BIOS setting
    SD functions as storage device only
Super I/O
  • Super I/O
  • Supported on carrier if needed (standard support for W83627DHG-P)
TPM
  • TPM
  • Chipset: Infineon Type: TPM 2.0
Power
  • Power
  • Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5%
    Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V
    Management: ACPI 5.0 compliant, Smart Battery support
    Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)
    ECO mode: Supports deep S5 mode for power saving
Operating Systems
  • Standard Support
  • Windows® 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)
  • Extended Support (BSP)
  • Linux 64-bit, VxWorks 64-bit (TBD)
Mechanical and Environmental
  • Form Factor
  • PICMG COM.0, Rev 3.0 Type 6
  • Dimension
  • Basic size: 125 mm x 95 mm
  • Operating Temperature
  • Standard: 0°C to 60°C
    Extreme Ruggeed: -40°C to +85°C (build option for selected SKUs)
  • Humidity
  • 5-90% RH operating, non-condensing
    5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
  • IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
  • HALT
  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

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